Product Overview
Application Field
| Application Field | Specific Application Scenarios | Application Field | Specific Application Scenarios |
|---|---|---|---|
| Electronic Device Cooling | Between CPU/GPU and heat sinks | Industrial & Energy Equipment | Photovoltaic inverters |
| Power modules (IGBT, PMIC, etc.) | Energy storage systems (battery clusters) | ||
| 5G communication equipment (base station RF modules) | Industrial automation equipment (PLC, servo drives) | ||
| Consumer Electronics | Smartphone / tablet processor cooling | Lighting & Display | High-power LED luminaires (street lights, display backlights) |
| Laptop motherboard chip cooling | Mini/Micro LED display chips | ||
| New Energy Vehicles | Power battery pack cooling | Other Fields | Aerospace electronic equipment |
| Motor controllers (IGBT modules) | Medical equipment (CT, MRI main control chips) | ||
| BMS battery management system |
Product Features
Performance Parameters
| Product Model P/N |
Thermal Conductivity W/m·K |
Density g/cm³ |
Hardness Shore OO |
Extrusion Rate g/min |
Volatile Content % |
Withstand Voltage KV/mm |
Volume Resistivity Ω·cm |
Flame Retardant Rating UL94 |
|---|---|---|---|---|---|---|---|---|
| GS6020‑AB | 2.0 | 1.95 | 60±5 | 10 | 60 | >6 | 1×10^12 | V0 |
| GS5030‑AB | 3.0 | 3.0 | 50±5 | 10 | 60 | >6 | 1×10^12 | V0 |
| GS5035‑AB | 3.5 | 3.1 | 50±5 | 10 | 60 | >6 | 1×10^12 | V0 |
| GS5050‑AB | 5.0 | 3.3 | 50±5 | 7 | 60 | >6 | 1×10^12 | V0 |
| GS5060‑AB | 6.0 | 3.4 | 50±5 | 7 | 60 | >6 | 1×10^12 | V0 |
| GS6080‑AB | 8.0 | 3.4 | 60±5 | 10 | 60 | >6 | 1×10^12 | V0 |
