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One-component thermal conductive gel

One-component thermal conductive gel

This product is a thermal material with extremely low deformation force and good plasticity. It can cover microscopically uneven surfaces so that mating parts come into full contact, improving heat transfer efficiency. Suitable for automotive electronics, industrial controllers, mobile communication devices, tablets, multimedia devices, desktops, laptops, servers, and printed circuit board assemblies.
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Product Overview Product Overview

Thermal gel is a semi-solid, flowable functional thermal medium material prepared through special processes, using polymer silicone oil or carbon-chain resin as the matrix, filled with highly thermally conductive fillers such as ceramic oxides, nitrides, and diamond. Due to its semi-solid state, it offers lower contact thermal resistance compared to thermal sheets of the same thermal conductivity.

Application Field Application Field

Application Field Specific Application Scenarios Application Field Specific Application Scenarios
Electronic Device Cooling Between CPU/GPU and heat sinks Industrial & Energy Equipment Photovoltaic inverters
Power modules (IGBT, PMIC, etc.) Energy storage systems (battery clusters)
5G communication equipment (base station RF modules) Industrial automation equipment (PLC, servo drives)
Consumer Electronics Smartphone / tablet processor cooling Lighting & Display High-power LED luminaires (street lights, display backlights)
Laptop motherboard chip cooling Mini/Micro LED display chips
New Energy Vehicles Power battery pack cooling Other Fields Aerospace electronic equipment
Motor controllers (IGBT modules) Medical equipment (CT, MRI main control chips)
BMS battery management system

Product Features Product Features

  • Good thermal conductivity
  • RoHS/REACH environmental compliance
  • Excellent wettability and low contact thermal resistance
  • Certain fluidity, versatile dispensing processes, and easy operation
  • Excellent anti-sagging and anti-cracking performance
  • Low compression stress, good plasticity, and resistance to various environmental stresses
  • UL94 V-0 flame retardant rating

Performance Parameters Performance Parameters

Product Model
P/N		 Thermal Conductivity
W/m·K		 Thermal Resistance
℃.in²/W		 Density
g/cm³		 Extrusion Rate
g/min		 Volatile Content
%		 Volume Resistivity
Ω·cm		 Flame Retardant Rating
UL94
GS0020 2.0 0.05 2.7 30 <1 1×10^13 V0
GS0030 3.0 0.045 3.0 30 <1 1×10^13 V0
GS0035 3.5 0.045 3.1 30 <1 1×10^13 V0
GS0050 5.0 0.042 3.2 20 <1 1×10^13 V0
GS0060 6.0 0.042 3.3 20 <1 1×10^13 V0
GS0080 8.0 0.04 3.4 15 <1 1×10^13 V0
GS0050 12.0 0.038 3.4 15 <1 1×10^13 V0