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Bonding thermal conductive potting compound

Bonding thermal conductive potting compound

Performance Parameters Performance Parameters

Product Model
P/N
Viscosity
cps
Hardness
Shore A
Thermal Conductivity
W/m·K
Tensile Strength
Mpa
Al/Al Shear Strength
Mpa
Dielectric Strength
KV/mm
Volume Resistivity
Ω·cm
PC8307P‑01AB 3500 25±5 0.7 1 1 16 1.0×10^14
PC8410P‑01AB 4000 25±5 1.0 1 1 16 1.0×10^14
PC8515P‑01AB 5000 25±5 1.5 1 1 16 1.0×10^14