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Low-stress thermal conductive potting compound

Low-stress thermal conductive potting compound

Performance Parameters Performance Parameters

Product Model
P/N
Viscosity
cps
Hardness
Shore A
Thermal Conductivity
W/m·K
Density
g/cm³
Dielectric Strength
KV/mm
Volume Resistivity
Ω·cm
PC8307S‑01AB 3200 20±5 0.7 1.6 10 1.0×10^14
PC8310S‑01AB 4000 20±5 1.0 1.75 10 1.0×10^14
PC8103S‑01AB 1000 30±5 0.2 1.0 10 1.0×10^15
PC8103S‑01AB 3000 30±5 0.2 1.0 10 1.0×10^15