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Two-component thermal conductive potting compound

Two-component thermal conductive potting compound

This product is a two-component potting compound consisting of liquid Part A and Part B. Mixed at a 1:1 ratio by weight, the two components cure into a high-performance elastomer through an addition reaction. It is mainly used for potting LED waterproof power supplies, inductors, sensors, automotive electronic modules, and electronic controllers.
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Product Features Product Features

  • No shrinkage or exotherm during curing
  • RoHS compliant
  • Insulating, waterproof, moisture-proof and non-corrosive
  • UL94V-0 flame retardant compliant
  • Wide temperature range (-50℃~200℃)

Performance Parameters Performance Parameters

Product Model
P/N 		Viscosity
cps 		Tack-Free Time
min 		Hardness
ShoreA 		Thermal Conductivity
W/m·K 		Dielectric Strength
kV/mm 		Volume Resistivity
Ω·cm
PC8307‑01AB 3200 30~120 50±5 0.7 16 1.0×10^14
PC8310‑01AB 3200 30~120 45±5 1.0 16 1.0×10^14
PC8312‑01AB 3200 30~120 45±5 1.2 16 1.0×10^14
PC8315‑01AB 3500 30~120 45±5 1.5 16 1.0×10^14
PC8420‑01AB 5000 30~120 45±5 2.0 16 1.0×10^14
PC8530‑01AB 8000 30~120 45±5 3.0 10 1.0×10^13
PC8535‑01AB 10000 30~120 45±5 3.5 10 1.0×10^13
PC8540‑01AB 12000 30~120 45±5 4.0 10 1.0×10^13