Application Field
| Application Field | Specific Application Scenarios | Application Field | Specific Application Scenarios |
|---|---|---|---|
| Electronic & Electrical | Chip, CPU & GPU cooling | Industrial Equipment | Industrial control board & inverter cooling |
| Power module & power device cooling | Laser & welding equipment cooling | ||
| Display backlight module cooling | Consumer Electronics | Smartphone & tablet cooling | |
| Automotive Electronics | Vehicle inverter & motor controller cooling | Laptop CPU/GPU cooling | |
| New energy vehicle battery pack cooling | Medical Equipment | Medical imaging equipment (e.g. CT, MRI) cooling | |
| Vehicle camera & sensor cooling | Portable medical devices (e.g. glucometers) cooling | ||
| Communication Equipment | Base station RF module & switch cooling | New Energy | Solar inverter cooling |
| Server & data center cooling | Energy storage system batteries | ||
| Aerospace | Satellite electronic components & aviation instrument cooling |
Contains no harmful substances, with excellent thermal conductivity and electromagnetic shielding performance, excellent flame retardancy, resistance to high and low temperatures, and low oil bleed rate. It can be used to fill structural gaps.
CPU, GPU, network communication equipment
Smartphones & tablets
Projector heat sinks
Vehicle electronics & server industry
Store in a dry, light-protected place
Storage temperature -5℃~+40℃
Validity: one year
Performance Parameters
| Model | / | CG5020A | CG5030A | CG6040A | CG6050A | |
|---|---|---|---|---|---|---|
| Thermal Conductivity | W/m.K | 2 | 3 | 4 | 5 | ASTM D5470 |
| Color | / | Dark gray | Dark gray | Dark gray | Dark gray | -D5 |
| Density | g/cm^3 | 4 | 4 | 4.2 | 4.2 | ASTM D792 |
| Thickness (±10%) | mm | 0.5‑5.0 | 0.5‑5.0 | 0.5‑5.0 | 0.5‑5.0 | ASTM D374 |
|
Reflection Loss @1.0mm |
dB | -5 (2G~6G) | -5 (2G~6G) | -5 (2G~6G) | -5 (2G~6G) | ASTM D5470 |
|
Compression Ratio @20psi 1.0mm |
% | 32 | 30 | 25 | 25 | - |
| Hardness | Shore OO | 50 | 50 | 60 | 60 | ASTM D2240 |
| Volume Resistivity | Ω·cm | 10^12 | 10^12 | 10^13 | 10^11 | GB/T 31838.2 |
| Flame Retardant Rating | / | V0 | V0 | V0 | V0 | UL.94 |
| Operating Temperature | ℃ | -40~+150 | -40~+150 | -40~+150 | -40~+150 | - |
| Self-Adhesiveness | / | Double-sided adhesive | Double-sided adhesive | Double-sided adhesive | Double-sided adhesive | - |
Features：
Contains no harmful substances, insulating, excellent flame retardancy, resistance to high and low temperatures, low oil bleed rate, excellent thermal conductivity, and can be used to fill structural gaps.
Applications：
Light sources, lenses, surveillance equipment, and sensors.
Features：
Contains no harmful substances, insulating, excellent flame retardancy, resistance to high and low temperatures, high compressibility with good cost-performance, easy to process and use, excellent thermal conductivity, and can be used between heat sources and heat dissipation surfaces with extremely low oil bleed.
Applications：
DMD chip modules / CPU, PA, GPU, IC, etc., projector security products, heat dissipation for various components and oil-bleed-sensitive fields, optical communication modules, and PCB circuit boards.
Features：
Contains no harmful substances, insulating, excellent flame retardancy, resistance to high and low temperatures, high compressibility, ultra-low volatility, low oil bleed, excellent thermal conductivity, and can be used to fill structural gaps.
Applications：
DMD chip modules / CPU, PA, GPU, IC, etc., projector security products, heat dissipation for various components and oil-bleed-sensitive fields, optical communication modules, and PCB circuit boards.
Features：
Contains no harmful substances, insulating, excellent flame retardancy, resistance to high and low temperatures, high compressibility with good cost-performance, easy to process and use, excellent thermal conductivity, and can be used between heat sources and heat dissipation surfaces with extremely low oil bleed.
Applications：
Communication equipment, network information equipment, laser driver modules, avionics instruments, scenarios with dielectric constant restrictions, surveillance equipment, RF amplifiers, and special interactive transceiver equipment.
Features：
Contains no harmful substances, insulating, excellent flame retardancy, resistance to high and low temperatures, high compressibility, low dielectric constant, good thermal conductivity and interface adhesion, low density, no interference with device electromagnetic wave signals, and contains no metal oxides.
Applications：
Communication equipment, network information equipment, laser driver modules, avionics instruments, scenarios with dielectric constant restrictions, surveillance equipment, RF amplifiers, and special interactive transceiver equipment.
Features：
Contains no harmful substances, insulating, excellent flame retardancy, resistance to high and low temperatures, high compressibility, low dielectric constant, good thermal conductivity and interface adhesion, low density, no interference with device electromagnetic wave signals, and contains no metal oxides.
Applications：
Communication equipment, network information equipment, laser driver modules, avionics instruments, scenarios with dielectric constant restrictions, surveillance equipment, RF amplifiers, and special interactive transceiver equipment.
Features：
Contains no harmful substances, insulating, good resistance to high and low temperatures, easy to operate and process, low density, good thermal conductivity and interface adhesion, and excellent flame retardancy.
Applications：
Drones, surveillance equipment, communication equipment, new energy vehicle batteries, and scenarios with weight restrictions.
Features：
Contains no harmful substances, insulating, excellent flame retardancy, low oil bleed rate, and high-temperature resistance: 250℃ 1000H high-temperature storage.
Applications：
Heat-generating chips, power heat dissipation devices, vehicle electronics, and power heat dissipation devices.
